Dimension: 166mm x 166mm ± 0.25mm Thickness: 170µm ± 19µm Front (-): Blue Antireflective Coating (silicon nitride), Texturized Surface (Alkaline), 1.9 ± 0.1mm wide segment silver busbar Back (+): Back-Surface Field (aluminum), 1.7 ± 0.2mm wide segment soldering, pads (silver/aluminum) Efficiency: 22.0%~23.0% High CTM performance with PID and shunt resistance