Etron has developed new DRAM architecture - RPC DRAM- World's First DRAM in a Fan-In Wafer Level Package. It's a 4.8GB/s 256Mb(x16) Reduced-Pin-Count DRAM and Controller Architecture (RPCA) to Reduce Form-Factor & Cost for IoT/ Wearable/ TCON/ Video/ AI-Edge Systems. RPC DRAM- featuring x16 DDR3 - LPDDR3 bandwidth but using only 22 switching signals in a 40 ball FI-WLCSP Package. The 256 Mbit DRAM is 2 x 4.7 mm. All 40 balls fit within the perimeter of the die using an industry standard 400 micron ball pitch making it the ideal memory for use in many wearable video-enabled IoT devices.